Lotus Microsystems to Exhibit at PCIM Europe 2025 – Hall 4A, Booth 418
Apr 3, 2025
Lotus Microsystems ApS, Hvidovre, Denmark
Lotus Microsystems is excited to announce our participation in PCIM Europe 2025, taking place in Nuremberg. Join us atHall 4A, Booth 418 to explore our latest advancements in powermanagement solutions designed for next-generation electronics.
On Display:
LTG – Lotus Thermal Guide Our intelligent thermal routing solution enhances heat dissipation in ultra-compact systems, making it ideal for high-performance, space-constrained designs.
LMU20P1 – High-Efficiency Boost Converter An ultra-compact and efficient boost converter tailored for low-power applications such as energy harvesting, IoT nodes, and wearables.
Lotus Power Interposer Technology Our unique silicon integration platform combines passives, control, and power switches - enabling unmatched power density, miniaturization, and thermal performance.
LTG Evaluation Board Debuting at PCIM Europe 2025, this evaluation board demonstrates the effectiveness of our LTG devices. Measuring 35 mm x 35 mm with a 2-layer design, 35 μm copper thickness, and a total board thickness of 0.8 mm, it has been characterized using FLIR A70 under ambient conditions. The device is stressed to stabilize at approximately 150°C without thermal aids, serving as a reference for the performance of our LTG devices.
